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Analysis of the optimization method of excessively dense solder joints in PCB circuit board design

source:Industry News release time:2022-08-26 Article author:yu Popular:pcb

  Analysis of the optimization method of excessively dense solder joints in PCB circuit board design(图1)

  PCB circuit board design solder joints are too dense, it is easy to cause continuous wave soldering and leakage between solder joints. Below, the editor of Zhongke circuit board manufacturer will analyze the optimization method of excessively dense solder joints in PCB circuit board design.

  Analysis of the optimization method of excessively dense solder joints in PCB circuit board design

  Analysis: This board has many plug-in components and is relatively dense. Because the spacing between the solder joints is 0.3-0.5mm, it is easy to cause continuous welding, and at the same time, due to the poor quality of the flux, a large amount of electricity leakage occurs in the rainy weather in the south.

  Countermeasures: Increase the spacing between solder joints and add solder mask oil in the middle. Strictly control flux quality.

  Thinking: When designing a denser PCB circuit board, try to make it denser in a small area, and open the place that can be opened as much as possible. For example, although the safe spacing of the PCB circuit board is 0.3MM, the place where 0.6MM can be achieved should be increased to more than 0.6 as much as possible, so that the probability of problems will be greatly reduced.


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