source:Industry News release time:2022-07-14 Article author:yu Popular:pcb
PCB Rogers high-frequency board refers to a special circuit board with high electromagnetic frequency, which is used for PCB in the field of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). CCL is a circuit board produced by using part of the process of ordinary rigid circuit board manufacturing methods or using special processing methods. Generally speaking, PCB Rogers high frequency board can be defined as a circuit board with a frequency above 1GHz. The substrate material needs to have excellent electrical properties, good chemical stability, and the loss on the substrate with the increase of the power signal frequency is required to be very small, so the importance of the PCB Rogers high-frequency board is highlighted.
What are the classifications of PCB Rogers high frequency board
1. Final ceramic filled thermosetting material
processing methods
The process is similar to epoxy resin/glass woven cloth (FR4), but the plate is brittle and easy to break, and the life of drill bit and gong knife is reduced by 20% when drilling and gong plate.
2. PTFE (polytetrafluoroethylene) material
processing methods
1. Cutting: The protective film must be kept for cutting to prevent scratches and indentations.
2. Drilling:
(1) Use a new drill bit (standard 130), one piece is the best, and the pressure of the presser foot is 40psi;
(2) The aluminum sheet is used as the cover plate, and then the PTFE plate is tightened with a 1mm melamine backing plate;
(3) Use an air gun to blow out the dust in the hole after drilling;
(4) Use the most stable drilling rig and drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the Chipload, the smaller the return speed).
3. Hole processing
Plasma treatment or sodium naphthalene activation treatment facilitates pore metallization
4. PTH copper sinking
(1) After micro-etching (the micro-corrosion rate has been controlled by 20 micro inches), pull the plate from the deoiling cylinder at the PTH;
(2) If necessary, pass the second PTH, and only need to start the plate feeding from the expected cylinder.
5. Solder mask
(1) Pre-treatment: use acid washing, not mechanical grinding;
(2) After pretreatment, bake the plate (90℃, 30min), brush green oil to cure;
(3) Baking the board in three stages: one stage at 80°C, 100°C, and 150°C, each for 30 minutes (if the substrate surface is found to be oily, it can be reworked: wash off the green oil and reactivate it).
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