source:Industry News release time:2022-09-19 Article author:yu Popular:pcb
Nowadays, with the development of electronic products in the direction of miniaturization, portability, networking and high performance, pcb board manufacturers have higher and higher requirements for PCBA circuit assembly technology and electronic components on PCBA processing circuit boards. High, most chips are getting smaller and smaller, and there are more and more pins, so it also greatly improves the technical requirements of chip processing factories in the production of pcba processing and defective pcba circuit board repair, and also provides chip processing. The relevant technical operators in the factory's smt technical workshop brought corresponding difficulties.
Therefore, general pcb factories need high-precision packaging technology, usually using BGA and other PCBA packaging processes, which can better ensure the quality stability of pcba circuit board products, and is also conducive to improving the process accuracy of scientific and technological production. Require.
Usually BGA, QFP, etc. are MSD3, which must be processed before repairing the PCBA circuit board in the patch processing factory: judge the surface temperature resistance of all components and accessories on the PCBA circuit board. Routine use of baking conditions: 60±5 degrees, baking 48~72H (depending on the actual situation of the PCBA), after baking, local heating can be used for repair work.
The smt process workshop involves the necessity of PCBA baking - the moisture inside the components on the PCBA circuit board is slowly discharged from the body through relatively slow heat, avoiding the PCBA. circuit board in the case of relatively fast heating such as reflow furnace welding of smt process equipment The moisture inside the components on the PCB expands rapidly, causing the alloy dots/plastic components on the PCBA circuit board to be affected by stress and affecting the reliability, causing the components on the PCBA circuit board to explode, resulting in the risk of potential failure of PCBA components.
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