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Manufacturing process of circuit board proofing manufacturer

source:Industry News release time:2022-10-19 Article author:yu Popular:pcb

  Manufacturing process of circuit board proofing manufacturer(图1)

  1、 Contact the manufacturer

  First, the manufacturer shall be informed of the documents, process requirements and quantities.

  2、 Material opening

  Purpose: According to the requirements of the engineering data MI, cut the large plates that meet the requirements into small pieces for production. Small plates that meet customer requirements

  Process: large plate → plate cutting according to MI requirements → curium plate → beer fillet edge grinding → plate out

  3、 Drilling

  Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the sheet metal with the required size

  Process: laminated pin → upper plate → drilling → lower plate → inspection/repair

  4、 Copperplate

  Purpose: Copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method

  Process: rough grinding → hanging plate → copper automatic line → lower plate → dipping 1% dilute H2SO4 → thickening copper

  5、 Graphic transfer

  Purpose: Graphic transfer is to transfer the image on the production film to the board

  Process: (blue oil process): plate grinding → printing the first side → drying → printing the second side → drying → lighting → developing → inspection; (Dry film process): hemp board → pressing film → standing → alignment → exposure → standing → developing → inspection

  6、 Graphic electroplating

  Purpose: Pattern electroplating refers to electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the circuit pattern

  Process: upper plate → degreasing → secondary water washing → micro etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate


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