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Overview of the Lamination Process of Multilayer Circuit Boards

source:Industry News release time:2022-06-22 Article author:yu Popular:pcb


  Overview of the Lamination Process of Multilayer Circuit Boards(图1)

  1. Autoclave pressure cooker

  It is a container filled with high-temperature saturated water vapor and can be applied with high pressure. The laminated substrate (Laminates) sample can be placed in it for a period of time to force the water vapor into the plate, and then the plate sample can be taken out. It was placed on a high-temperature molten tin surface to measure its "anti-delamination" characteristics. This word is also synonymous with PressureCooker, which is more commonly used in the industry. In addition, in the multi-layer circuit board lamination process, there is a "cabin pressure method" with high temperature and high pressure carbon dioxide, which also belongs to this type of AutoclavePress.

  2. CapLamination cap pressing method

  It refers to the traditional lamination method of early multi-layer PCB boards. At that time, the "outer layer" of MLB mostly used thin substrates with copper skin of single-sided multi-layer circuit boards for lamination and lamination, until the output of MLB increased significantly at the end of 1984. , before switching to the current copper-skin-type large-scale or large-scale pressing method (MssLam). This early MLB lamination method using a single-sided copper thin substrate is called CapLamination.

  3. Crease wrinkles

  In the lamination of multi-layer circuit boards, it often refers to the wrinkles that occur when the copper skin is not handled properly. When the thin copper sheet below 0.5oz is laminated in multiple layers, this disadvantage is more likely to occur.

  4. CaulPlate separator

  When the multi-layer circuit board is pressed, many "books" of loose materials (such as 8~10 sets) of the board to be pressed are often stacked between each opening of the press machine (such as 8-10 sets), and each set of "loose materials" (Book) must be separated by a flat, smooth and hard stainless steel plate. The mirror stainless steel plate used for this separation is called CaulPlate or SeparatePlate. Currently, AISI430 or AISI630 are commonly used.


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