(1) Pole wall concave erosion / removing hole wall resin drilling

　　For the general FR-4 multi-layer printed circuit board manufacturing, the removal of the resin drilling and recessed treatment of the removal of the pores after the CNC drilling is usually there are usually concentrated sulfuric acid treatment method, chromic acid treatment method, and potassium permanganate Solution treatment method and plasma treatment method.

　　However, for the treatment of deflection circuit boards and rigid-deflection circuit boards to remove drilling, due to the different characteristics of the material, if the above chemical treatment method is used Drilling and concave erosion can obtain a better roughness of the hole wall, which is conducive to the metallic electroplating of the hole, and has the connection characteristics of the "three -dimensional" concave erosion.

　　(2) Revidence and treatment of polytetrafluoroethylene materials

　　Any engineer for the metallic manufacturing of polytetrafluoroethylene material pores has such experience: the method of using a general FR-4 multi-layer printed circuit boardhole metalization method is that it is not possible to obtain the successful polytimoniated polytimonia Ethylene printed circuit board. Its biggest difficulty is that it is the most critical step before chemical sinking copper activation before activation.

　　There are many methods that can be used for activation of polytetrafluoroethylene materials before chemical copper, but in summary, the following two methods can be achieved to ensure the quality of the product and suitable for production:

　　(A) Chemical treatment method

　　Metal sodium , react in solutions such as non -water solvents such as tetrahydrofuu or ethylene glycol dihalin, forming a complication of sodium sodium. The sodium sodium treatment liquid can be eroded in the surface atomic atomic atomic atomic atomic in the pore, thereby achieving the purpose of wet the wall. This is a classic successful method, with good effect, stable quality, and currently the most widely used.

　　(B) Plasma treatment method

　　The processing method here is the process of dry law, which is easy to operate, the quality is stable and reliable, and it is suitable for mass production. In terms of the sodium cricket treatment liquid of the chemical treatment method, it is difficult to synthesize, toxicity, and the shelf life is relatively short. It is necessary to formulate according to the production conditions, and the safety requirements are high.

　　Therefore, most of the activation treatment of polytetrafluoroethylene surface is performed by plasma treatment methods, which is convenient to operate and significantly reduces wastewater treatment.

　　(3) Removal of carbides

　　The plasma treatment method not only has obvious effects in the drilling treatment of various types of plates, but also show its superiority in composite resin materials and tiny pores. In addition, with the increasing demand for manufacturing the manufacturing demand for higher interconnection density accumulation, a large amount of laser technology is used for blind hole manufacturing as a payment product for laser drilling blind holes -carbon carbon In the end, it is necessary to remove it before the production process of the hole. At this time, the plasma treatment technology did not deny the heavy responsibility of removing carbides.

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