source:Industry News release time:2022-06-18 Article author:yu Popular:pcb
Prepreg is a sheet-like material composed of resin and carrier. Among them, the resin is in the B-stage, under the action of temperature and pressure, it has fluidity and can quickly cure and complete the bonding process, and together with the carrier form an insulating layer. Commonly known as prepreg or adhesive sheet. In order to ensure the high reliability and quality stability of the multilayer printed circuit board, it is necessary to conduct quality inspection on the characteristics of the semi-solid (trial lamination method). The characteristics of circuit board electroplating prepreg include the characteristics before lamination and the characteristics after lamination. The properties before lamination mainly refer to: resin content %, fluidity %, volatile content % and gel time (S). The properties after lamination refer to: electrical properties, thermal shock properties and flammability. For this reason, in order to ensure the high reliability of the multilayer printed circuit board and the stability of the lamination process parameters, it is very important to detect the characteristics of the electroplated prepreg of the circuit board before lamination.
1. Determination of circuit board resin content (%):
(1) Preparation of test piece: according to the direction of the fiber of the circuit board electroplating prepreg: cut into small test pieces of 100×100 (mm) at an angle of 45°;
(2) Weighing: use a balance with an accuracy of 0.001 gram to weigh Wl (gram);
(3) Heating: heating and burning for 60 minutes at a temperature of 566.14 ° C, and then weighing W2 (grams) after cooling;
(4) Calculation: W1-W2 resin content (%)=(W1-W2)/W1×1002.
2. Determination of circuit board resin flow (%):
(1) Test piece production: according to the fiber direction of the electroplated prepreg on the circuit board, cut into 100×100 (mm) pieces of about 20 grams test pieces at a 45° angle;
(2) Weighing: use a balance with an accuracy of 0.001 g to accurately weigh W1 (g);
(3) Heating and pressurizing: the temperature of the pressing bed heating plate is adjusted to 171 ± 3 °C, when the test piece is placed in the heating plate, the applied pressure is above 14 ± 2Kg/cm2, heating and pressing for 5 minutes, the outflow glue is removed and Carry out weighing W2 (grams);
(4) Calculation: resin flow (%)=(W1-W2)/W1×1003.
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