1. Storage environment and transportation: This is the link between the circuit board factory and the patch factory. Generally, the circuit board rarely has inventory, but the general inventory requires that the storage environment is dry and humid, the packaging is complete, and it is required to be as light as possible during transportation. Handle with care, can not allow the vacuum package to be damaged and stored for a long time. The theoretical storage time of the tin-sprayed board is one month, but the best time for solderability is within 48 hours. If the storage time exceeds one month, it is recommended to return to the circuit board factory. The potion cleans and bakes the plate. Baking plate parameters 150 °, 1 hour

　　2. The operation did not follow the operating specifications when shipping: the circuit industry is a workshop environment, and the requirements for employees to standardize the operation are extremely strict, especially the chemical reaction environment is required in the circuit board production process, so the infiltration of impurities is not allowed. After the board tin spraying process is completed, the subsequent series of operations require employees to wear anti-static gloves, because finger sweat or stains directly contact the surface, which will cause surface oxidation. If it causes defects, it is extremely difficult to find, and it is irregular. And the tin experiment is difficult to show.

　　3. Welding defects caused by warpage: The circuit board and components are warped during the welding process, and defects such as virtual welding and short circuit occur due to stress deformation. Warpage is often caused by an unbalanced temperature between the upper and lower parts of the board. For large PCBs, warpage will also occur due to the board's own weight falling. Ordinary PBGA devices are about 0.5mm away from the printed circuit board. If the device on the circuit board is large, as the circuit board returns to its normal shape after cooling down, the solder joints will be under stress for a long time. If the device is raised by 0.1mm, it is enough to cause For special products, the open circuit of virtual welding can require the yin and yang stitching of the circuit board factory to help reduce warpage, or to adopt the stitching of the appropriate size as much as possible, neither too large nor too small.

　　:4. The source of tin for incoming materials: For material procurement, some circuit board factories blindly pursue cost reduction. When using tin-sprayed raw tin, tin is recycled in the procurement industry, or sources with unstable content, generally with extremely low unit prices. Circuit board factories may have such risks, and it is recommended that you choose suppliers carefully.

　　5. The tin furnace used for tin spraying is not cleaned on time: the timely maintenance of the tin furnace is very important, because tin spraying is a vertical cycle process, and the surface of the circuit board will be under strong pressure. The board will be impacted and fall off, deposited in the furnace, and evaporated at high temperature. If it is not cleaned for too long, it will cause surface adhesion.

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