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The advantages of copper cladding on the circuit board outweigh the disadvantages or the disadvantag

source:Industry News release time:2022-08-13 Article author:yu Popular:pcb

  The advantages of copper cladding on the circuit board outweigh the disadvantages or the disadvantag(图1)

  The so-called copper pouring is to use the idle space on the PCB as the reference plane, and then fill it with solid copper. These copper areas are also called copper pouring.

  The significance of copper cladding lies in: reducing the impedance of the ground wire and improving the anti-interference ability; reducing the voltage drop and improving the efficiency of the power supply; connecting with the ground wire can also reduce the loop area, etc.

  There are generally two basic ways of copper cladding, that is, large-area copper cladding (solid copper cladding) and grid copper cladding. Which is better for large-area copper cladding or grid copper cladding? It's hard to generalize, they each have their pros and cons.

  1. Advantages of solid copper cladding: it has the dual functions of increasing current and shielding. Disadvantages: If it is wave soldered, the board may warp or even blister. Solution: Generally, several slots will be opened to relieve copper foil blistering.

  2. Advantages of grid copper cladding: From the point of view of heat dissipation, grid is good (it reduces the heating surface of copper) and plays a certain role in electromagnetic shielding. Disadvantages: The pure copper grid is mainly used for shielding, and the effect of increasing the current is reduced.

  The pros and cons of PCB copper cladding

  Advantage: Provides additional shielding protection and noise suppression for inner signal. Improve the heat dissipation capacity of the PCB. In the production process of PCB circuit board, the amount of corrosive agent is saved.

  Avoid the warping and deformation of the PCB caused by the different stress generated during the reflow soldering of the PCB circuit board due to the unbalanced copper foil.

  Disadvantages: The copper-clad plane on the outer layer will be fragmented by the components and signal lines on the surface. If there is a poorly grounded copper foil (especially the slender and long broken copper), it will become an antenna and generate EMI. question.

  If the electronic component pins are fully connected with copper, the heat will be dissipated too quickly, making it difficult to desolder and rework. The copper-clad plane of the outer layer must be well grounded, and more vias need to be drilled to connect to the main ground plane. Too many vias will inevitably affect the wiring channel unless buried blind vias are used.

  Precautions for copper cladding

  When engineers are pouring copper, in order to achieve the expected effect of copper pouring, they need to pay attention to the following aspects:

  1. For single-point connection of different grounds, the method is to connect through 0 ohm resistance or magnetic beads or inductance.

  2. Metals inside the device, such as metal radiators, metal reinforcement bars, etc., must be "well grounded".

  3. The island (dead zone) problem, if you think it is too big, then it will not cost much to define a ground via and add it.

  4. Do not cover the open area of wiring in the middle layer of the multi-layer circuit board. Because it is very difficult for you to make this copper pour "good ground".

  5. Copper cladding near the crystal oscillator. The crystal oscillator in the circuit is a high-frequency emission source. The method is to wrap copper around the crystal oscillator, and then ground the shell of the crystal oscillator separately.


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