One, the definition of thick copper plate

　　thick copper board refers to a printed circuit board with a copper thickness ≥ 3oz completed in any of the inner or outer layers.

　　Second, the characteristics of thick copper plate

　　The thick copper plate has the characteristics of carrying large current, reducing thermal strain, and good heat dissipation.

　　1. Thick copper circuit board can carry large current

　　In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of the circuit, which can carry a larger current, so it has the characteristic of carrying a large current.

　　The characteristics of thick copper plate

　　2. Thick copper circuit board reduces thermal strain

　　Copper foil has a small electrical conductivity (also called electrical resistivity, 1.72*10-8ΩΩ·m) when the temperature rise is small when a large current passes, so it can reduce the amount of heat and thus reduce the thermal strain.

　　The conductivity is the resistivity. Metal "conductors" are divided into conductivity according to conductivity:

　　silver→copper→gold→aluminum→tungsten→nickel→iron.

　　3. Thick copper circuit board has good heat dissipation

　　Copper foil has high thermal conductivity (thermal conductivity 401W/mK), which can play an important role in improving heat dissipation performance, so it has good heat dissipation;

　　The thermal conductivity refers to the heat transfer through an area of 1m2 within 1H of a 1m thick material with a temperature difference of 1°C on both sides under stable heat transfer conditions. The unit is W/m·K.

　　The thick copper plate has good heat dissipation

　　Three, the market application of thick copper plate

　　The application field and demand of thick copper plate have been rapidly expanded in recent years, and it has become a kind of "hot" PCB variety with good market development prospects.

　　The vast majority of thick copper plates are high-current substrates (current x voltage = power). The main application areas of high-current substrates are two major areas: power modules (power modules) and automotive electronic components. Some of its main terminal electronic product fields are the same as conventional PCBs (such as portable electronic products, network products, base station equipment, etc.), and some are different from conventional PCB fields, such as automobiles, industrial controls, and power modules.

　　There is a difference in efficacy between high-current substrates and conventional PCBs. The main function of a conventional PCB is to form a wire for transmitting information. The high-current substrate has a large current through it, and the main function of the substrate carrying the power device is to protect the current carrying capacity and stabilize the power supply. The development trend of such high-current substrates is to carry larger currents, and the heat emitted by larger devices needs to be dissipated. Therefore, the large currents passing through them are getting larger and larger, and the thickness of all the copper foils of the substrates is getting thicker and thicker. The 6oz copper thickness of the high-current substrates manufactured now has become the norm;

　　thick copper circuit board

　　The application areas of thick copper circuit boards include: mobile phones, microwaves, aerospace, satellite communications, network base stations, hybrid integrated circuits, power high-power circuits and other high-tech fields.

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