source:Industry News release time:2021-12-02 Article author:sznbone Popular:pcb
The packaging substrate is the largest cost of IC packaging, accounting for more than 30%. IC packaging costs include packaging substrates, packaging materials, equipment depreciation and testing. The IC carrier cost accounts for more than 30%. It is the largest cost of integrated circuit packaging and occupies an important position in integrated circuit packaging. For IC carrier boards, substrate materials include copper foil, substrate, dry film (solid photoresist), wet film (liquid photoresist), and metal materials (copper balls, nickel beads, and gold salts). The proportion of substrates exceeds 30 %, is the most expensive end of the IC carrier board.
1. One of the main raw materials: copper foil
Similar to the PCB of a flexible circuit board factory, the copper foil required for the IC carrier substrate must be an ultra-thin and uniform copper foil, and the thickness can be as low as 1.5. The thickness of copper foil used in traditional PCB is about 18-35. The price of ultra-thin copper foil is higher than that of general electrolytic copper foil, and it is difficult to process.
2. Main raw material: bottom plate
The substrate of the carrier substrate is similar to the copper clad laminate of the PCB, which is mainly divided into three types: hard substrate, flexible film substrate and co-fired ceramic substrate. The development of co-fired ceramic substrates tends to slow down.
The key considerations for IC carrier substrates include requirements for dimensional stability, high frequency characteristics, heat resistance, and thermal conductivity.
There are currently three main materials for rigid packaging substrates: BT materials, ABF materials and MIS materials.
Flexible packaging substrate materials mainly include PI (polyimide) and PE (polyester) resins.
Ceramic packaging substrate materials are mainly ceramic materials such as alumina, aluminum nitride, and silicon carbide.
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