source:Industry News release time:2022-06-16 Article author:yu Popular:pcb
The characteristics of high-density HDI circuit board production equipment are: under the condition that the cost of making HDI circuit board production lines continues to rise, how to improve the productivity of the production line and the price of materials, especially when the price of copper is soaring, how to maintain product stability. , product quality and economic benefits are also very worth weighing. These are the problems faced and expected to be solved by custom HDI circuit board manufacturers, as follows:
1. The thickness of the coating produced by the electroplating process for the HDI circuit board should be uniform;
2. Output can be increased by optimizing equipment and current density;
3. The optimized plating solution can control the base copper in the range of 1-5μM;
4. In view of the through holes and micro holes of HDI circuit boards, the plating solution is required to have good dispersion;
5. According to the through holes and micro holes of the HDI circuit board, the concavity in the same plating solution is required to be the smallest;
6. No copper surface layer is seriously polluted, the finish of the coating is small, and the plating solution is seriously polluted;
7. The standard of plating on the thin base copper plate with high current density and the thickness of the electroplated copper layer are the same.
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