1. smt patch processing link

　　The system quality control details of solder paste printing and reflow temperature control in smt chip processing PCBA are the key points in the PCBA manufacturing process. For high-precision pcb circuit board printing with special and complex processes, laser stencils are used according to specific processing and production conditions to meet the quality standards of pcb circuit boards. According to the PCB manufacturing requirements and customer product characteristics, the patch processing factory needs to add U-shaped holes or reduce steel mesh holes in some parts; it is necessary to do certain processing work on the steel mesh according to the requirements of the PCBA processing technology.

　　Among them, the temperature control accuracy of the reflow oven is very important for the wetting of solder paste and stencil welding. It is also adjusted according to the normal SOP operation guidelines to reduce the minimum loss rate and reduce the production process of the SMT technology link of PCBA patch processing. In addition, the technical operators of the smt technology production workshop of the patch processing factory must conduct AOI tests in strict accordance with the standards, which can greatly reduce the occurrence of defective products caused by human factors in the process of pcba processing and production. is happening.

　　2. DIP plug-in post-weld link

　　The post-soldering of the DIP plug-in is also an important step in the pcb processing stage of the pcb circuit board. The requirements and standards of the oven jig are also critical. After the PCBA is overheated, the use of the furnace fixture can greatly improve the yield rate and reduce the occurrence of welding defects such as continuous tin, less tin, and lack of tin. It is also according to the different requirements of customer products. According to the standard, pcba processing plants must constantly sum up experience in practice, and realize technological upgrading in the process of accumulating rich experience.

　　3. Test and program triggering

　　The manufacturability report is the evaluation work performed by the chip processing factory before the entire production after receiving the customer's production contract, and then in the early DFM report, the chip processing factory will also evaluate the PCB circuit board. Communicate with customers before processing and provide some effective suggestions, such as setting up some key test points on the PCB, which will help the continuity and connectivity of the circuit board after the pcb solder test and subsequent PCBA processing. The key test of sex. If conditions permit, you can communicate with the customer to provide the back-end program, and then burn the PCBA program into the core main control IC through the burner; in this way, you can directly touch the pcb circuit board through touch actions. The test work is convenient to test and check the integrity of the entire processed PCBA, and the PCBA of defective products can be found at the first time.

　　4.PCBA test link

　　Customers who provide one-stop PCBA processing services also have certain implementation standards for the back-end testing of PCBA. The content of pcba test generally includes ICT (circuit test), FCT (function test), burnout test (aging test), temperature and humidity test. , drop test, etc. The relevant personnel in the smt workshop of the chip processing factory must undergo strict standard on-the-job training.

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