source:Industry News release time:2022-08-11 Article author:yu Popular:pcb
1. If the circuit board is heated unevenly, last in first out, the defect of PCB board bending is prone to occur;
2. When entering the tin furnace, the surface tension of the liquid tin on the pad will be arc-shaped, resulting in uneven thickness of the tin on the pad, and due to the blowing force and gravity of the hot air, the lower edge of the pad will produce tin sag. Soldersag makes the welding of SMT surface mount parts not easy to stick firmly, and it is easy to cause the offset of the parts after welding or tombstoning;
3. The smaller the circuit board pad, the more obvious the tin arc on the surface of the pad, and the worse the flatness.
Solution:
For BGA package boards with less than 14MIL pads or boards with high flatness requirements, considering the hidden dangers of tin spraying, it is not recommended to make tin spraying boards. It can be changed to immersion gold or gold plating. If customers must make tin spraying circuits Board, the customer's requirements for flatness must be clearly defined.
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