source:Industry News release time:2022-07-05 Article author:yu Popular:pcb
With the development of electronic products to high density and high precision, the same requirements are also placed on PCB circuit boards. The most effective way to increase the density of blind and buried vias is to reduce the number of through holes, and to precisely set blind and buried vias to meet this requirement, thus forming HDI blind and buried vias.
HDI Blind and Buried Via Circuit Board is a compact product designed for small-capacity users. It has a modular and parallel design. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be placed directly in a 19" rack and up to 6 modules can be connected in parallel. The product adopts full digital signal process control (DSP) technology and a number of A patented technologies, regardless of the load power factor and crest factor, it has comprehensive adaptive load capacity and strong short-term overload capacity.
HDI blind and buried via circuit boards are mainly manufactured using micro blind via and buried via technology. It is characterized in that the electronic circuits in the printed circuit board can be distributed with a higher circuit density, and because of the substantial increase in circuit density, printed circuit boards made of HDI blind buried via boards cannot be used. Typically, for drilling, HDI must use a non-mechanical drilling process. There are many non-mechanical drilling methods. Among them, "laser drilling" is the main hole-forming solution for HDI circuit board high-density interconnection technology.
HDI Blind and Buried Via circuit boards are usually manufactured by a build-up method. The longer the settling time, the higher the technical grade of the board. It can reduce the cost of blind and buried via circuit boards (PCB high multi-layer circuit boards): when the density of the PCB increases to more than eight layers, it is manufactured with HDI blind and buried via circuit boards, and its cost will be lower than the traditional complex pressing process.
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