source:Industry News release time:2022-07-06 Article author:yu Popular:pcb
The film of the long board/ultra-long board circuit board: it is usually the tentover process that people talk about, and the applied potion is the acid-base etching process film because after the film photo is made, the required route or copper surface is fully transparent. The part that cannot be used is gray-black. After being exposed through the route processing process, the fully transparent part is oxidized and hardened due to the wet film resist being irradiated by sunlight. The hardened wet film is washed away, so the ultra-long circuit board only bites away the wet film during the etching process and washes away a part of the copper (the gray and black part of the film photo), and the preserved wet film is not washed away. on the route we want (part of the film photo with full transparency)
The whole piece of the ultra-long board circuit board: it is usually the patTri processing technology that people talk about, and the xian potion used is a partial alkali etching process. Part of it can be fully transparent. After exposure through the route processing process, the fully transparent part is oxidized and hardened due to the sunlight exposure of the wet film resist, and the subsequent developer processing process will not harden the primer. The wet film is washed away, followed by the process of electroplating tin and lead. The tin and lead are plated on the copper surface washed away by the wet film of the previous process (developer), and then the film is removed (remove the hard bottom due to sunlight exposure). In the next etching process, the copper moor without tin and lead maintenance is cut off with alkaline water (a part of the film photo is completely transparent), and the rest is the route we want (the film photo gray black part)
The whole film and film are actually selected according to the processing technology of each long board/ultra-long board circuit board factory. The whole film: the processing technology is (two-sided circuit board) cutting material - punching - CCP (one-time electroplating process Also known as thickened copper) - route - two copper (pattern electroplating process) and then take the SES line (film removal - etching process - tin removal) film: the processing technology is (double-sided circuit board / ultra-long board circuit board) Cutting material - punching - CCP (one-time electroplating process is also called thickened copper) - route (do not pass the two copper pattern electroplating process) and then take the DES line (etching process - film removal)
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