source:Industry News release time:2021-11-26 Article author:sznbone Popular:pcb
The area of the copper surface on the circuit board is uneven, which will worsen the bending and warping of the board.
1. Generally, a large area of copper foil is designed on the circuit board for grounding purposes. Sometimes there is also a large area of copper foil designed on the Vcc layer. When these large area copper foils cannot be evenly distributed on the same sheet When the circuit board is used, it will cause the problem of uneven heat absorption and heat dissipation. Of course, the circuit board will also expand and contract. If the expansion and contraction cannot be performed at the same time, it will cause different stress and deformation. At this time, the temperature of the circuit board If the upper limit of the Tg value has been reached, the circuit board will begin to soften, causing permanent deformation.
2, the connection points (vias, vias) of each layer on the circuit board will limit the expansion and contraction of the board.
Today's circuit boards are mostly multi-layer circuit boards, and there will be rivet-like connection points (vias) between the layers. The connection points are divided into through holes, blind holes and buried holes. Where there are connection points, there will be restrictions. The effect of expansion and contraction of the multi-layer circuit board will indirectly cause the circuit board to bend and warp.
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