source:Industry News release time:2023-08-16 Article author:yu Popular:pcb
PCB circuit boards are prone to solder back problems during the production process, causing bending and warping of the board, which affects the product qualification rate. So, how to reduce the risk of bending and deformation in PCB circuit board production?
1. The effect of reducing temperature on the stress of PCB circuit boards. Due to temperature being the main source of stress on circuit boards, as long as the temperature of the reflow furnace is reduced or the production heating speed of the circuit board in the welding furnace is slowed down, the bending and warping of the board can be greatly reduced.
2. The use of boards with higher Tg can increase their ability to withstand stress deformation, but the production cost of circuit boards is also relatively high.
3. Increase the thickness of the PCB circuit board. Many electronic products have circuit board thicknesses of 1.0mm, 0.8mm, or 0.6mm for lighter purposes. It is recommended that if there are no requirements, the circuit board should be 1.6mm thick, which can greatly reduce the risk of bending and deformation of the board.
4. Reduce the size of the circuit board and reduce the number of plywood. Due to the fact that most welding furnaces use chains to drive the circuit board forward, the circuit board may sag and deform in the back welding furnace due to its own weight. Therefore, it is advisable to use the circuit board as the edge of the back welding board to reduce the sagging deformation caused by the weight of the circuit board itself.
5. Use furnace holder fixtures. Habitually using a furnace to reduce deformation can reduce plate bending on the furnace. If a single-layer tray cannot reduce the deformation of the circuit board, a cover must be added to clamp the upper and lower layers of the tray together to reduce the deformation problem of the welding furnace above the circuit board.
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