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What are the three main factors that constitute welding defects in PCB circuit boards?Multilayer PCB

source:Industry News release time:2023-08-16 Article author:yu Popular:pcb

  


What are the three main factors that constitute welding defects in PCB circuit boards?Multilayer PCB(图1)

  In recent years, with the development of PCB board soldering technology, reflow soldering technology has become a trend. Below, let Shenzhen PCB manufacturers explain in detail: What are the three main factors that constitute welding defects in PCB circuit boards?

  1. The solderability of PCB board holes affects welding quality

  The poor solderability of PCB holes will result in solder defects, affecting the parameters of components in the circuit, causing unstable conduction of multi-layer board components and inner wires, and leading to the failure of the entire circuit function.

  2. Welding defects caused by PCB board warping

  PCB boards and components undergo warping during the welding process, resulting in defects such as solder joints and short circuits due to stress deformation. Warping is often caused by uneven temperature distribution between the upper and lower parts of a PCB board. In addition, for large-sized PCB boards, they may also experience warping due to their own weight drop.

  3. The design of PCB board affects welding quality

  In terms of planning, when the PCB board size is too large, although welding is easy to control, the printed lines are long, the impedance increases, the noise resistance decreases, and the cost increases; If it is too small, the heat dissipation will decrease, and welding is difficult to control, resulting in adjacent lines interfering with each other, such as electromagnetic interference. Therefore, it is necessary to optimize the PCB board design.


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