source:Industry News release time:2022-03-21 Article author:sznbone Popular:pcb
In 1961, Hazelting Corp. of the United States published Multiplanar, which was the pioneer in the development of the first multi-layer board. This method is almost the same as the current method of manufacturing multi-layer boards using the plated-through hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods for multi-layer boards have gradually become popular all over the world. With the transition from transistors to the era of integrated circuits, the application of computers has gradually become common, and due to the demand for high functionality, large wiring capacity and good transmission characteristics have become the focus of multi-layer boards.
At first, three manufacturing methods of multi-layer boards were disclosed by the clearance method (Clearance Hole) method, the build-up method (Build Up) method, and the plating-through method (PTH) method. Since the mesoporous method is labor-intensive and limited in high density, it has not been put into practical use. The build-up method has been unknown because of its complex manufacturing method and the advantages of high density, but because the demand for high density was not as urgent as it is now, it has been unknown. Recently, due to the increasing demand for high density circuit boards, it has been Become the focus of research and development of various manufacturers. As for the PTH method, which has the same process as the double-sided panel, it is still the mainstream manufacturing method for multi-layer boards.
The production method of multi-layer boards is generally made by the inner layer pattern first, and then the single-sided or double-sided substrate is made by printing and etching method, and is incorporated into the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling The hole is the same as the plated-through hole method of the double-sided board. These basic manufacturing methods have not changed much from those dating back to the 1960s. However, as materials and process technologies (eg: press-bonding technology, solving slag during drilling, and film improvement) have become more mature, the attached The characteristics of pre-multilayer boards are more diverse.
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