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The history and development trend of PCB.Electronic Manufacturing Services PCB

source:Industry News release time:2022-05-20 Article author:yu Popular:pcb

  The history and development trend of PCB.Electronic Manufacturing Services PCB(图1)

  The history of PCB

  In 1925, Charles Ducas in the United States printed circuit patterns on insulating substrates, and then established wires by electroplating. This is a sign of the beginning of modern PCB technology.

  In 1947, epoxy resin began to be used to make substrates.

  In 1953, Motorola developed a double-sided plated through-hole method, which was then applied to multi-layer circuit boards.

  In 1960, V. Dahlgreen made a flexible printed circuit board by sticking a metal foil film with a printed circuit in the plastic.

  In 1961, HazelTIneCorporaTIon in the United States referred to the electroplating through-hole method to produce a multi-layer board.

  In 1995, Matsushita Electric developed the ALIVH build-up printed circuit board.

  In 1996, Toshiba developed the B2IT build-up printed circuit board.

  At the end of the 20th century, new technologies such as Rigid-Flex, buried resistance, buried capacitance, and metal substrates continued to emerge. PCB is not only the carrier to complete the interconnection function, but also as an extremely important component in all electronic products. to a pivotal role.

  The development trend of PCB design

  Driven by Moore's Law in the electronics industry, the functions of products are getting stronger and stronger, the integration level is getting higher and higher, the signal rate is getting faster and faster, and the research and development cycle of products is getting shorter and shorter. Due to the continuous miniaturization, precision and high-speed of electronic products, PCB design not only needs to complete the circuit connection of various components, but also considers various challenges brought by high-speed and high-density.

  PCB design is no longer a subsidiary of hardware development, but an important part of "front-end IC, back-end PCB, SE integration" in product hardware development.

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