Traditional circuit boards are often divided into single-sided PCB boards, double-sided circuit boards, and PCB multi-layer boards, and PCB multi-layer boards are further divided into single-press and multiple-press structures. This design of course involves some electrical properties and link density issues, but due to the rapid advancement of electronic product technology, these geometries cannot meet the component mounting density and electrical requirements. In order to increase the link density of components, from a geometrical point of view, only by compressing the space of lines and connection points, can more contacts be accommodated in a small space to increase the link density. Of course, multiple components can also be stacked in one position to increase the packing density. Therefore, high-density circuit boards are not only a circuit board technology, but also an issue of electronic packaging and assembly.

　　In order to improve the connection density of components, from a geometrical point of view, only by compressing the space between lines and connection points, so that more connections can be accommodated in a smaller space, the connection density can be improved. Of course, there is a different idea, that is, multiple different components can be stacked in the same location to increase the density of the construction. Therefore, from a certain point of view, high-density circuit boards are not only a technical problem of circuit boards, but also a problem of electronic assembly and assembly. This aspect is probably worth some effort by the industry to understand.

　　PCB multilayer board

　　Generally, the so-called electronic package refers to the connection between the semiconductor chip and the carrier board. In this regard, the Civil Road Board Association has published a special book on "electronic component carrier board technology", and those who are interested can refer to it. As for the electronic assembly part, it is the work of re-installing the components after the electronic assembly is completed on another functional circuit board. This connection, generally called OLB (outerleadbond), refers to the connection part of the outer pins of the component. The connection of this part is directly related to the surface contact density of electronic components. When the functions and integration of electronic products are getting higher and higher, and at the same time, the demand for mobility, thinness and multi-functionality is constantly pushed up. , of course there will be high densification pressure.

　　If a high-density circuit board design concept is adopted, electronic products can gain the following benefits:

　　1. The high-density circuit board structure adopts a thinner dielectric thickness, and the potential inductance is relatively low.

　　2. The micro-hole has a low aspect ratio, and the signal transmission reliability is higher than that of the general through-hole.

　　3. Micro holes can improve the flexibility of circuit configuration and make circuit design easier.

　　4. The same product design can reduce the number of carrier layers, increase the density and reduce the cost.

　　5. The use of micro-hole interconnection can shorten the contact distance, reduce signal reflection, and crosstalk between lines, and the components can have better electrical properties and signal accuracy.

　　6. Increase the wiring density and increase the line capacity per unit area with micro-hole thin lines, which can meet the assembly requirements of high-density contact components, and is conducive to the use of advanced assembly.

　　7. High-density circuit board micro-via technology allows the carrier board design to shorten the distance between grounding and signal layers, thereby improving RF/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of components caused by instantaneous discharge due to static electricity accumulation.

　　Modern and popular electronic products should not only have the characteristics of mobility and power saving, but also have no burden to wear and look beautiful. Of course, the most important thing is that they are affordable and can be replaced with fashion.

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